Binding: Hardcover Dewey Decimal Number: 620 EAN: 9780735401860 ISBN: 0735401861 Label: American Institute of Physics Manufacturer: American Institute of Physics Number Of Items: 1 Number Of Pages: 1930 Publication Date: July 22, 2004 Publisher: American Institute of Physics Sales Rank: 3949469 Studio: American Institute of Physics
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Product Description
All papers have been peer-reviewed. The Cryogenic Engineering Conference covers applications and systems at temperatures where ordinary gases are liquids or solids, generally less than 150 K (-120°C or 185°F). It covers the newest approaches to producing low temperatures and to the use of systems at low temperatures, such as new superconducting magnets, high temperature superconducting electrical power applications, space applications and the properties of fluids and materials at these temperatures. Design, construction, testing, and characterization of cryogenic systems are presented.
Topics include: Hydrogen: Past, Present, and Future; Liquefied Natural Gas; Liquid Helium: Refrigeration and Supply; Large Scale Cryogenic Systems; Large Scale Cryogenic Test Facilities; Expanders, Pumps, and Compressors; Large Cryosystem Components and Issues; Cryogenic Instrumentation, Controls, and Measurements; Cryostats: Design and Performance; Cryostates and Cryogenics for Herschel-Planck Mission; Superconducting RF Systems; Thermal Insulation; Material, Property Measurements; Low Temperature Superconducting Magnet Systems; High Temperature Superconducting Magnet Systems; High Temperature Superconducting Cables; High Current Leads; Helium II Phenomena; Fluid Dynamics, Heat Transfer, and Thermodynamics; Cryogenics at Zero G; Cryocooler Programs Overviews; Cryocooler Reliability; Stirling Cryocoolers; Pulse Tube - G-M Type; Pulse Tube JT and Heat Exchanger Modeling and Performance Issues; Brayton, Collins, Sorption Cryocoolers; JT and Thermoacoustic Cryocoolers; Magnetic Refrigeration; Hybrid Cycle Cryocoolers; Terrestrial Applications of Cryocoolers; and Novel Concepts or Devices.
